Hardware Intelligence.
Software Mastery. One Partner.

As a Firmware Developer, you will be the primary architect for the software stack of our custom controller board. You will manage a dual-processor environment, programming the RP2354 for system-level logic and an NXP RFID/NFC Chipset for secure data transactions. A critical part of this role involves developing Linux Device Drivers to ensure seamless data flow between the controller hardware and our primary Linux host systems.

• Dual-Processor Firmware: Design and implement firmware for the RP2354 using its dual-core ARM Cortex-M33 capabilities to manage system-level I/O, timing, and peripheral control.
• RFID/NFC Integration: Program and optimize the NXP RFID Chipset (e.g., PN5190, PN5180, or CLRC663) using the NXP Reader Library. Handle complex ISO14443/15693 protocols and secure key management.
• Linux Kernel Development: Create and optimize Linux Device Drivers (SPI/I2C/USB) to interface the controller hardware with a Linux-based application layer.
• Inter-Processor Communication (IPC): Develop low-latency, reliable communication bridges between the RP2354 and the NXP chipset using high-speed SPI or I3C.
• Full-Stack Application: Write Linux user-space applications (C++/Python) to provide a high-level API for external software to interact with the RFID hardware.

• Core Architectures: Expert knowledge of ARM Cortex-M33 and Raspberry Pi's PIO (Programmable I/O) for custom signal handling.
• NXP Ecosystem: Proficiency with the NXP Reader Library and experience interfacing standalone NFC frontends with external microcontrollers.
• Linux Systems: Deep experience in Kernel-mode driver development, including DMA handling and interrupt management.
• Languages: Mastery of C and Embedded C++.
• Protocols: Expert-level understanding of SPI (up to 15Mbps), I2C, UART, and USB stacks.

• Architecture: The RP2354 features 2MB of internal flash and dual M33 cores. How would you distribute the RFID stack and system logic across these two cores to ensure zero latency in card detection?
• PIO Usage: If the NXP chipset requires a non-standard handshake signal, how would you use the RP2354 PIO to offload that timing from the main CPU cores?

• Frontend vs. Controller: We are using an NXP Frontend (like the PN5190) rather than an integrated controller. Describe the challenge of managing the timing-critical layers of the NFC stack on the RP2354.
• RF Optimization: How would you implement Dynamic Power Control (DPC) or load modulation in firmware to ensure the reader works reliably near metal surfaces?
• Antenna Tuning: What firmware registers in the NXP chipset would you monitor to diagnose a poorly tuned or detuned antenna in the field?

• Concurrency: If the Linux host and the RP2354 both need to access the RFID chipset status simultaneously, how would you implement a locking mechanism in your driver to prevent data corruption?
• Latency: In a Linux environment, what techniques would you use to ensure that an interrupt from the RFID chipset is handled in real-time for a fast tap-and-go experience?

We are seeking a versatile CAD Engineer to lead the physical design and layout of our advanced controller boards. You will be responsible for the full PCB lifecycle — from footprint creation to generating manufacturing-ready Gerber/ODB++ packages. The ideal candidate is a power user in Altium Designer for complex, high-speed projects and is equally proficient in KiCad for agile, open-hardware, or rapid-prototyping initiatives.

• Dual-Platform Layout: Execute high-density, multi-layer (4–10+ layers) PCB designs in Altium and KiCad, selecting the best tool based on project requirements.
• High-Speed Routing: Implement controlled impedance, differential pairs, and length-matching for high-speed buses (USB 2.0/3.0, SPI, and memory interfaces).
• Library Management: Build and maintain centralized component libraries (symbols, 3D STEP models, and footprints) compliant with IPC-7351 standards across both platforms.
• Signal & Power Integrity: Perform basic SI/PI analysis to minimize crosstalk, EMI, and power-rail noise, especially around sensitive RFID/NFC frontends.
• DFM/DFA/DFT: Conduct thorough Design for Manufacturing and Assembly reviews to ensure high yields and lower production costs at EMS providers.
• MCAD Collaboration: Coordinate with mechanical engineers to ensure PCB-to-Enclosure fitment using Altium 365 or KiCad's STEP export features.

• EDA Expertise: 6 months+ of experience with Altium Designer (Unified environment, ActiveBOM) and KiCad (Version 7.0/8.0).
• PCB Technology: Expertise in HDI (High-Density Interconnect), micro-vias, and complex layer stack-up definitions.
• RF Awareness: Familiarity with PCB antenna design and isolation techniques for NXP RFID/NFC chipsets.
• Standards: Strong knowledge of IPC-2221 (Design) and IPC-610 (Acceptability).
• Version Control: Proficiency in using Git for managing KiCad project files and Altium 365 for cloud-based versioning.

We are looking for a Developer/Engineer who thrives at the intersection of the physical and digital worlds. In this role, you will build the "brain" of our ecosystem — developing MERN-based web applications that ingest, process, and visualize real-time data from IoT devices. You are not just a coder; you are a problem solver who anticipates bottlenecks in data flow and implements best-practice cloud architectures on AWS and Azure.

• IoT Ecosystem Integration: Build secure, bi-directional communication between devices and the cloud using protocols like MQTT, WebSockets, and HTTP.
• Time-Series Data Management: Architect high-throughput ingestion pipelines using TimescaleDB to handle millions of data points from sensors with sub-millisecond query performance.
• Hybrid Cloud Infrastructure: Design and maintain a resilient environment using AWS IoT Core or Azure IoT Hub, ensuring 99.9% uptime for device connectivity.
• Edge & Cloud Logic: Implement Edge Computing best practices to process data closer to the source, reducing latency and cloud costs.
• Security First: Enforce end-to-end security, including X.509 certificate management, encryption at rest/transit, and IAM/Role-Based Access Control.

• MERN Mastery: Deep expertise in Node.js, Express, React, and MongoDB.
• Relational & Time-Series: Advanced SQL skills (MySQL, MSSQL) and hands-on experience with TimescaleDB (Hypertables, continuous aggregates, and compression).
• AWS: IoT Core, Lambda, Kinesis, RDS, S3.
• Azure: IoT Hub, Azure Functions, Stream Analytics, Cosmos DB.
• DevOps: Experience with Docker/Kubernetes and CI/CD pipelines for automated, zero-downtime deployments.

• Analytical Troubleshooting: When a device stops reporting, you trace the issue from the firmware-to-cloud handshake down to database indexing — not just reset it.
• Scalable Thinking: You apply DRY, SOLID principles, and clean architecture to keep the codebase maintainable as we scale to thousands of devices.
• Efficiency Obsession: You proactively optimize database queries and cloud resource usage to ensure high performance and low costs.
• Passion for Quality: You believe "if it's not tested, it's broken" — and lead by example with high unit and integration test coverage.

We are looking for a detail-oriented Electronics Technician / Junior Engineer to manage the full lifecycle of PCB assembly and testing. You will be the bridge between design and physical production, ensuring that every board is assembled correctly, tested rigorously, and that manufacturing coordination with external vendors remains seamless.

• PCB Assembly: Hands-on soldering (SMD and Through-hole), component mounting, and visual inspection of populated boards.
• Testing & Debugging: Conducting functional tests using multimeters, oscilloscopes, and LCR meters. Identifying dry solder, short circuits, or faulty components.
• BOM Preparation: Working with the design team to create and verify Bills of Materials (BOM). Ensuring component footprints match the physical parts.
• Manufacturing Coordination: Interfacing with PCB fabrication and assembly (PCBA) houses. Tracking production timelines and managing inward/outward material logs.
• Inventory Management: Organizing and tracking electronic component stocks to prevent production delays.

• Soldering: High proficiency in manual soldering and rework (fine-pitch SMD preferred).
• Schematic Reading: Ability to read and interpret circuit diagrams and PCB layout files.
• Component Knowledge: Deep understanding of passive and active components (resistors, capacitors, ICs, connectors).
• Tools: Experience with soldering stations, heat guns, multimeters, and basic PC-based testing software.
• Documentation: Basic proficiency in MS Excel / Google Sheets for BOM management and tracking.

• Proximity: Ideally residing in or near Banashankari, Girinagar, Katriguppe, or Padmanabhanagar for an easy commute.
• Mindset: A "Design-First" attitude with a focus on quality and precision.
• Experience: 1–3 years in an electronics manufacturing or R&D environment. Freshers with strong project experience may be considered.